Evaluation of a new range of light-activated surgical adhesives for tissue repair in a porcine model

Jill N. Riley, Diane E. Hodges, Keith L. March, Karen M. McNally-Heintzelman

Research output: Contribution to journalArticle

3 Scopus citations

Abstract

An in vitro study was conducted to determine the feasibility of using a new range of light-activated surgical adhesives for incision repair in a wide range of tissue types. Biodegradable polymer membranes of controlled porosity were fabricated with poly(L-lactic-co-glycolic acid) (PLGA) and salt particles using a solvent-casting and particulate-leaching technique. The porous membranes were doped with protein solder composed of 50%(w/v) bovine serum albumin solder and 0.5mg/ml indocyanine green (ICG) dye mixed in deionized water. Tissue incisions were repaired using the surgical adhesive in conjunction with an 805-nm diode laser. Nine organs were tested ranging from skin to liver to the small intestine, as well as the coronary, pulmonary, carotid, femoral and splenetic arteries. Acute breaking strengths were measured and the data were analyzed by Student's T-test. Repairs formed on the small intestine were most successful followed by spleen, atrium, kidney, muscle and skin. The strongest vascular repairs were achieved in the carotid artery and femoral artery. The new surgical adhesive could possibly be used as a simple and effective method to stop bleeding and repair tissue quickly in an emergency situation, or as a substitute to mechanical staples or sutures in many clinical applications.

Original languageEnglish (US)
Pages (from-to)220-225
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4244
DOIs
StatePublished - Jan 1 2001

Keywords

  • Albumin protein solder
  • Diode laser
  • Indocyanine green dye
  • Polymer membrane
  • Repair strength

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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