High temperature characteristics and solidification microstructures of dental metallic materials part III alloys for metal-bond porcelain

Sakae Nagasawa, Takamitsu Yoshida, Nobuyoshi Terashima, Toshihide Mizoguchi, Hiroshi Yagasaki, Koichiro Kamijo, Michio Ito, Jeffrey A. Platt, Yoshiki Oshida

Research output: Contribution to journalArticle

Abstract

The thermal expansion rate, coefficient of thermal expansion, and high temperature strength of two types of commercially available alloy for metal-bond porcelain, KIK-HII (KIK) and Degubond-J2 (J2), were evaluated up to the liquidus point temperature using a thermo-mechanical analyzer. Furthermore, microstructure in the solid-liquid coexisting region was observed for evaluation. Our results revealed the following findings: 1. For KIK, solidus point was 1,209.3±3.2°C, liquidus point was 1,308.3±7.1°C, and melting expansion rate was 0.41± 0.16%. 2. For J2, solidus point was 1,198.3±0.6°C, liquidus point was 1,253.0±4.4°C, and melting expansion rate was 4.50±0.80 %. 3. At high temperature, the mechanical characteristics of KIK greatly differed from those of J2. The risk of causing deformation during porcelain baking was suggested for KIK. Removal of segregation during casting was considered difficult in J2.

Original languageEnglish (US)
Pages (from-to)140-148
Number of pages9
JournalDental Materials Journal
Volume24
Issue number1
DOIs
StatePublished - Mar 2005

Keywords

  • Alloy for metal-bond porcelain
  • High temperature characteristics
  • Solidification microstructure

ASJC Scopus subject areas

  • Ceramics and Composites
  • Dentistry(all)

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