Simplification of finite element models for thermal fatigue life prediction of PBGA packages

Hasan U. Akay, Yan Liu, Mostafa Rassaian

Research output: Contribution to journalArticle

30 Citations (Scopus)

Abstract

The use of PBGA (plastic ball grid array) electronic packages has been greatly increased in the last decade due to high I/O densities offered. The fatigue life prediction for them is a relatively new task in the electronic field. PBGA packages have more complex geometry than conventional SMT (surface mount technology) packages, such as Leaded and Leadless Chip Carriers (LDCC and LLCC), in which the I/O pins are distributed along the perimeters of chip carriers and their geometries are suitable for two-dimensional (2-D) finite element (FE) simulation. This choice is not so clear in PBGAs. In this study, sectional 2-D, sliced three-dimensional (3-D), and 1/8th 3-D FE models for PBGA assemblies are compared to determine the appropriate FE models that are able to save computational time and memory while maintaining reasonable calculation accuracy. The comparisons and merits of each modeling approach are discussed. An energy-based method is used to predict the fatigue life for solder joints in PBGAs. The fatigue coefficients in the correlation equation, which were obtained previously from the analysis of traditional SMT packages, are updated for more accurate prediction. New fatigue coefficients are obtained for different modeling approaches.

Original languageEnglish (US)
Pages (from-to)347-353
Number of pages7
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume125
Issue number3
DOIs
StatePublished - Sep 2003

Fingerprint

Ball grid arrays
Thermal fatigue
Fatigue of materials
Plastics
Surface mount technology
Geometry
Soldering alloys
Data storage equipment

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Simplification of finite element models for thermal fatigue life prediction of PBGA packages. / Akay, Hasan U.; Liu, Yan; Rassaian, Mostafa.

In: Journal of Electronic Packaging, Transactions of the ASME, Vol. 125, No. 3, 09.2003, p. 347-353.

Research output: Contribution to journalArticle

@article{79a6c048785b47c48b3303de9b1b39c9,
title = "Simplification of finite element models for thermal fatigue life prediction of PBGA packages",
abstract = "The use of PBGA (plastic ball grid array) electronic packages has been greatly increased in the last decade due to high I/O densities offered. The fatigue life prediction for them is a relatively new task in the electronic field. PBGA packages have more complex geometry than conventional SMT (surface mount technology) packages, such as Leaded and Leadless Chip Carriers (LDCC and LLCC), in which the I/O pins are distributed along the perimeters of chip carriers and their geometries are suitable for two-dimensional (2-D) finite element (FE) simulation. This choice is not so clear in PBGAs. In this study, sectional 2-D, sliced three-dimensional (3-D), and 1/8th 3-D FE models for PBGA assemblies are compared to determine the appropriate FE models that are able to save computational time and memory while maintaining reasonable calculation accuracy. The comparisons and merits of each modeling approach are discussed. An energy-based method is used to predict the fatigue life for solder joints in PBGAs. The fatigue coefficients in the correlation equation, which were obtained previously from the analysis of traditional SMT packages, are updated for more accurate prediction. New fatigue coefficients are obtained for different modeling approaches.",
author = "Akay, {Hasan U.} and Yan Liu and Mostafa Rassaian",
year = "2003",
month = "9",
doi = "10.1115/1.1569956",
language = "English (US)",
volume = "125",
pages = "347--353",
journal = "Journal of Electronic Packaging, Transactions of the ASME",
issn = "1043-7398",
publisher = "American Society of Mechanical Engineers(ASME)",
number = "3",

}

TY - JOUR

T1 - Simplification of finite element models for thermal fatigue life prediction of PBGA packages

AU - Akay, Hasan U.

AU - Liu, Yan

AU - Rassaian, Mostafa

PY - 2003/9

Y1 - 2003/9

N2 - The use of PBGA (plastic ball grid array) electronic packages has been greatly increased in the last decade due to high I/O densities offered. The fatigue life prediction for them is a relatively new task in the electronic field. PBGA packages have more complex geometry than conventional SMT (surface mount technology) packages, such as Leaded and Leadless Chip Carriers (LDCC and LLCC), in which the I/O pins are distributed along the perimeters of chip carriers and their geometries are suitable for two-dimensional (2-D) finite element (FE) simulation. This choice is not so clear in PBGAs. In this study, sectional 2-D, sliced three-dimensional (3-D), and 1/8th 3-D FE models for PBGA assemblies are compared to determine the appropriate FE models that are able to save computational time and memory while maintaining reasonable calculation accuracy. The comparisons and merits of each modeling approach are discussed. An energy-based method is used to predict the fatigue life for solder joints in PBGAs. The fatigue coefficients in the correlation equation, which were obtained previously from the analysis of traditional SMT packages, are updated for more accurate prediction. New fatigue coefficients are obtained for different modeling approaches.

AB - The use of PBGA (plastic ball grid array) electronic packages has been greatly increased in the last decade due to high I/O densities offered. The fatigue life prediction for them is a relatively new task in the electronic field. PBGA packages have more complex geometry than conventional SMT (surface mount technology) packages, such as Leaded and Leadless Chip Carriers (LDCC and LLCC), in which the I/O pins are distributed along the perimeters of chip carriers and their geometries are suitable for two-dimensional (2-D) finite element (FE) simulation. This choice is not so clear in PBGAs. In this study, sectional 2-D, sliced three-dimensional (3-D), and 1/8th 3-D FE models for PBGA assemblies are compared to determine the appropriate FE models that are able to save computational time and memory while maintaining reasonable calculation accuracy. The comparisons and merits of each modeling approach are discussed. An energy-based method is used to predict the fatigue life for solder joints in PBGAs. The fatigue coefficients in the correlation equation, which were obtained previously from the analysis of traditional SMT packages, are updated for more accurate prediction. New fatigue coefficients are obtained for different modeling approaches.

UR - http://www.scopus.com/inward/record.url?scp=0141918651&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0141918651&partnerID=8YFLogxK

U2 - 10.1115/1.1569956

DO - 10.1115/1.1569956

M3 - Article

AN - SCOPUS:0141918651

VL - 125

SP - 347

EP - 353

JO - Journal of Electronic Packaging, Transactions of the ASME

JF - Journal of Electronic Packaging, Transactions of the ASME

SN - 1043-7398

IS - 3

ER -